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Tuesday 21 May 2024
PowerArena eliminates manufacturers' pain points with AI-enabled human factor data analytics
In the face of rapid industry changes, labor shortages, and high worker turnover, manufacturers have difficulty upholding production efficiency and product quality. Worse yet, they have to address overwhelming challenges as traditional SOPs can no longer ensure consistent quality across process steps and they have no real-time access to critical production data. PowerArena provides an AI solution that will help manufacturers overcome these challenges and boost their competitiveness.
Tuesday 7 May 2024
STAr Technologies and EDA Industries announce strategic partnership
STAr Technologies, Inc. (STAr) and EDA Industries (EDA) are pleased to announce a mutually strategic business expansion partnership. Combining product scopes and sales networks, this agreement will lead STAr and EDA's growth in the global semiconductor testing market at the highest level.
Tuesday 7 May 2024
Navigating the maze: Export compliance in electronics industry
In the complex space of global trade, export compliance requirements play a pivotal role for businesses in the electronic industry. Export compliance encapsulates a comprehensive set of regulations and laws, dictating the movement of goods and electronic components across international borders. From export controls and licensing requirements to trade embargoes and sanctions, compliance with these mandates is imperative for maintaining the integrity and security of global trade.
Tuesday 30 April 2024
Era of earbud compromises now over; Skyline, xMEMS solid-state acoustic vent, enables earbuds that excel in every situation
xMEMS introduced the Skyline DynamicVent in 2023 to solve many of the unaddressed consumer experience issues with TWS earbuds. Skyline is a novel, but straightforward extension of xMEMS' innovative MEMS speaker platform that enables a system DSP to actively control the venting and leakage of ambient air into the earbud. How can a MEMS acoustic vent bring the next level of innovation to true wireless stereo (TWS) earbuds? First, we need to examine the current state of the wireless earbud market to understand how this MEMS vent can enable future earbuds to dynamically adapt to multiple environments and situations and improve the consumer experience.
Tuesday 30 April 2024
Thailand authorities set to block local access to unauthorized crypto exchanges
Authorities in Thailand have decided to block access to all cryptocurrency exchanges not authorized to operate in the country. The order is aimed at fighting money laundering and several other online crimes.
Thursday 25 April 2024
SK Hynix announces 1Q24 financial results
SK hynix Inc. (or "the company", www.skhynix.com) announced today that it recorded 12.43 trillion won in revenues, 2.886 trillion won in operating profit (with an operating margin of 23%), and 1.917 trillion won in net profit (with a net margin of 15%) in the first quarter.
Wednesday 24 April 2024
Automate 2024: Cincoze to display AI edge computing solutions
Rugged embedded computer brand – Cincoze, will be at Automate 2024 (South Hall, Stand 1062) in Chicago, USA, on May 6–9, 2024. Cincoze will display its range of world-class industrial embedded computing products around the theme of "Comprehensive AI Edge Computing Solutions" encompassing the full spectrum of industrial application environments in four dedicated zones, including the Rugged Embedded Computers, Industrial Panel PCs & Monitors, Embedded GPU Computers, and New Products.
Thursday 18 April 2024
Connections Summit 2024 gathers RFID industry to discuss market trends, technical developments and future use cases for technology
Connections Summit 2024 takes place between 13-16th May in Taichung, Taiwan. The event will bring together the RFID industry for four days of learning, networking and cultural experiences, covering current and future RFID market trends, technical developments and emerging use cases for the technology.
Thursday 18 April 2024
GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that the GLink-3D interface (GUC's Link for 3D die stacking) for the TSMC 3DFabric SoIC-X 3D stacking platform passed comprehensive silicon testing, validating 3DIC interface hardening flow. The first GUC 3D customer project also passed complete silicon testing, validating a full spectrum of 3D implementation services for AI/HPC/Networking applications.
Wednesday 17 April 2024
DigiKey and NXP unveil MCX MCU Design Contest at Embedded World 2024
DigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, is excited to announce its teaming up with NXP Semiconductors to launch the MCX MCU Design Contest at embedded world. Using NXP's new FRDM development boards, contest participants are invited to submit design ideas and projects for a chance to win a variety of prizes, including a grand prize package containing a 14-inch MacBook Pro, Apple Watch Series 9, and AirPods Pro.